Qiangmao has launched a new generation of GBU-2/KBJ-2 bridge rectifiers, with rated currents ranging from 4A to a maximum of 35A. The new bridge rectifiers optimize the internal structure, enhance heat dissipation performance, and achieve optimal thermal conductivity. The design significantly reduces power loss, making them particularly suitable for high-current and high-wattage power supply systems.

Cyntec has launched a new generation of 2-8A, 1000V DXK packaged, general series bridge rectifiers, featuring improved forward surge current and high-temperature, low reverse leakage current characteristics. Intelligent manufacturing optimizes production parameters to provide bridge products with lower power consumption, thereby enhancing system efficiency.

PANJIT has launched automotive-grade 200V ultra-fast recovery rectifiers, the MER&MSR series products, with rated currents ranging from 1A to 20A. Thin packages include SOD-123FL, SOD-123HE, SMA, SMB, SMAF-C, and SMBF, suitable for replacing conventional axial-lead or MELF components in surface-mount applications. High-power packages include TO-220AC, ITO-220AC, TO-220AB, and ITO-220AB, with a total of 62 products launched, 25 of which are AEC-Q101 certified.

The HTC863XA and HTC72XA are low-noise, low-voltage, and low-power operational amplifiers. These series of chips can be used in a very wide range of applications. Their input common-mode voltage range extends to ground, with maximum input offset voltages of 4.2 mV and 3.5 mV, respectively. Under heavy loads, they can provide rail-to-rail output swings. The HTC863XA operates with a single supply voltage ranging from +2.3V to +5.5V, while the HTC72XA operates with a single supply voltage ranging from +2.5V to +5.5V. The operating temperature for the chips ranges from -40°C to +125°C.

On the afternoon of September 19, 2022, the GAN+DBC Module HERA 100 Product Launch for the Power Supply Research Institute was held in the group's main conference room. This marks the debut of Qunji's first independently developed third-generation semiconductor application integration chip—the "Qunji Core." Director Liu Yang of the Power Supply Research Institute introduced the "Qunji Core" based on market research, product background, product features, and advantages.